Technical Capabilities

Printed Circuits singlesided, doublesided, multilayer ( up to 24 layers )
Base material Isola, Rogers, NAN YA, ...
DE104iIS400IS410G200I-Tera MT40,
RO4003CRO4350RO4450, ...
Cu thickness 5, 9, 12 ,18, 35, 70 ,105, 140, 210 um
Base thickness 75 µm - 5,00 mm
Max. size singlesided - 490 x 380 mm
multilayer - 480 x 340 mm
Minimal drilled
diameter
through hole and buried via - from 0,15 mm
( finish hole after plating 0,05 mm )
blind via - from 0,125 mm
back drilling
Minimal line 70 µm
Minimal space 70 µm
Aspect ratio 10 : 1
Controlled Impedance default out layers ±15%
default inner layers ±10%
Surface ENIG ( Ni / Au )
Universal Pad Finish - ENEPIG ( Ni / Pd / Au )
Chemical Tin ( Sn )
HAL Lead Free
Peelable solder resist printing
Carbon
Hard gold ( connectors )
Soldermask green, blue, black, red, white, transparent and more
Legend white, black, yellow and more
Contour routing
routing on breaking tabs
deep routing
plated cut-outs and edges
V-scoring
plated Castellated holes on the board edge
Screens for solder paste 100, 150, 200, 250 um
Data format ODB++, gerber 274x, gerber, excellon, DXF, PDF, EPS
sieb & meyer, IPC D-356A, IPC-D-356, IPC-2581-B,
Eagle and more
Service design and development of pcb
pcb assembly
microsections
solder paste stencils
Delivery singlesided and doublesided from 24 hrs
multilayer from 48 hrs
standard delivery 10 w.d.

Pb-free Universal Pad Finish (ENEPIG)

   We are newly offering you lead free final surface treatment technology on printed circuit boards - Universal Pad Finish ( Electroless Nickel / Electroless Palladium / Immersion Gold - ENEPIG or also NiPdAu ), which is also suitable for component bonding ( wire bonding ) with fine wire. Some resources call this technology with shorter name as Universal Finish.

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