Technological capabilities

We are ready to manufacture all kinds of printed circuit boards from simple to those deigned for high-end applications in an HDI, MICROVAWE or CONTROLLED IMPEDANCE design, using BLIND VIA, BURIED VIA, THROUGH-BOARD VIA, and µBGA technologies.
We are often directly involved in PCB design.
  • Printed circuit boards: single-sided, double-sided, multilayer (also for high-end applications)
  • Materials we use: Isola, Rogers, NAN YA, ..., DE104F, IS400, IS410, G200, I-Tera MT40, RO4003C, RO4350B, PCL370HR
  • Base copper thickness: 5, 9, 18, 35, 70, 105, 210µm
  • Board thickness: 75µm through 5.00mm
  • Board dimensions: single and double-sided – 490×380mm, multilayer – 470×340mm
  • Smallest drilled hole diameter: through and buried – 0.12mm (0.05mm after via plating), blind – 0.12mm (conical tool) controlled depth (back) drilling
  • Smallest track width: 70µm
  • Smallest track spacing: 70µm
  • Maximum aspect ratio: 10:1
  • Controlled impedance: standards outer layers ±10%, standard inner layers ±10%
  • Finish: chemical gold – ENIG (Ni/Au), lead free HAL/HASL, immersion tin (Sn), peelable mask, carbon, hard electrolytic gold (for edge connectors)
  • Solder mask colours: green, blue, black, red, white, transparent (other options to be agreed)
  • Service print colours: white, black, yellow (other options to be agreed)
  •  Edge machining: milling, milling with bridges, deep milling, metal plated cutouts and edges, metal plated castellated holes, V-scoring
  • Silkscreen stencils: etched or laser-cut, material thickness 100–250µm
  • Data formats: ODB++, Gerber 274x, Gerber, Excellon, DXF, PDF, EPS, Sieb & Meyer, IPC D-356A, IPC-D-356, IPC-2581-B, Eagle, and many others
  • Other services: PCB design, PCB assembly, putting artwork on film, silkscreen stencil production, metallographic cross-sectioning, X-ray inspection of surface features
  • Lead times: express from within 24 hours Further as agreed

Data correction – printing

Print on solder pads

Does your design system generate prints (silkscreen) on solder pads or thin line labels? You need not waste your time with manual corrections. We do this for you while processing your PCB production data using an automated method.
This correction is necessary to utilize the option of a 100% electric test as a prevention of problems in PCB assembly with components.

Data correction – masking

Solder mask overhang

To prevent problems in PCB production and, mainly, in PCB assembly, solder mask should overhang the pads in adjacent layers (top and bottom) to a certain degree. Design systems, depending on their settings, mostly generate this overhang incorrectly, resulting in avoidable complications.
Therefore, we recommend generating solder mask pad size as 1:1 with solder pads. We then take care of this issue while processing your PCB production data in an automated manner.
If the width of a gap between SMD pads in the artwork is below 200µm, we are technologically unable to achieve the bridge in the solder mask. The smallest bridge width is at least 120µm.