• Advanced equipment and materials
    Highest standards
  • Moderní technologie a materiály
    Nejvyšší standardy
  • Moderní technologie a materiály
    Nejvyšší standardy
  • Nejnáročnější technologie
    30-ti letá tradice výroby desek plošných spojů
  • Nejnáročnější technologie
    30-ti letá tradice výroby desek plošných spojů
  • Nejnáročnější technologie
    30-ti letá tradice výroby desek plošných spojů
  • Nejnáročnější technologie
    30-ti letá tradice výroby desek plošných spojů

Equipment

With respect to the wide range of printed circuit boards produced, we utilize advanced equipment from renowned manufacturers. We capitalize on our active long-term relationships with leading suppliers of equipment and materials in the industry. We strive to partner with our customers by supporting development of printed circuits boards for high-end applications at the highest conceivable quality.


Equipment

Technological capabilities 


Wide range of printed circuit boards, including HDI, MICROVAWE, and CONTROLLED IMPEDANCE. VIA, BLIND VIA, BURIED VIA, and µBGA technologies







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Equipment


CUBE CZ has and uses advanced equipment from renowned manufacturers. We capitalize on our active long-term relationships with the most prominent suppliers of equipment making maximum use of their technical support. Our system of internal process monitoring reflects our responsible approach to manufacturing processes with an emphasis on their stability.

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Technology and Technology Devices
 

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Used materials and applications

Our new manufacturing equipment

 

After several months of a selection process and step-by-step physical on site testing with Schmoll Maschinen, we have made the decision to go ahead with a major investment into our PCB manufacturing process. We have purchased a new-generation, fully automated Micromirror Direct Imaging (MDI) equipment. The latest universal Schmoll Maschinen technology utilizing high-power UV LEDs with Digital Micromirror Device (DMD) control provides efficient direct imaging on a photosensitive layer of non-soldering mask, photoresist as well as service prints.

 

This fully automated equipment has expanded our technological limits and it increases flexibility of the PCB manufacturing process, especially for High Density Interconnect (HDI) boards. Setting up the new direct imaging equipment, significant improvements of our particle-free air-conditioned premises also took place.

Certificates and Certifications 2018

Certificates for download as format pdf.