We arrange assembly of printed circuit boards from our production. Such assembly is carried out by partners with our authorization and many years of experience in this line of business, using the state-of-the-art technologies with the options of optical, functional and X-ray inspection and testing of assembled boards.

SMT line - SMD component size – from 0603 (mm) / 0201 (in) to 22mm. Automated assembly machine cameras with capability to resolve IC and connector leads at 0.3mm spacing (0.4mm spacing practically tested).  The camera resolution for BGA and CSP packages is 0.5mm. Assembly of printed circuit boards from 50×40mm to 460×400mm at thickness up to 4.2mm. Making a special fixture is required to handle printed circuit board thinner than 0.38mm. Soldering is done either in reflow ovens or in vapour phase reflow soldering equipment.

Soldering for through-hole components can either be using an all-areas wave or selective wave process.

Automated 3D optical inspection and X-ray inspection equipment (typically to check BGA and QFN devices).