CUBE CZ continue modernization of its production sequence associated with the ongoing testing of newly developed materials for Printed Circuit Boards.

Implementation of UV curing technology for effective hardening of the applied solder resist material is another substantial step not only for the ability to produce PCB´s in HDI clasification, but also step further in terms of stabilizing the production process, which is an important aspect for us, especially for the quick service projects.

UV Bump technology from traditional german manufacturer Beltron GmbH is a high-performance horizontal technology applying UV curing to both sides in one process step.